Build – High Complexity, High Reliability

Zentech provides a wide range of manufacturing solutions specializing in high-complexity and high-reliability program requirements. Our services include:

• Design for Manufacturability
• Prototype and Volume Production
• New Product Introduction
• Printed Circuit Card Assembly
• Lot Control and Traceability
• Chassis and Box Build
• Test Services
• System Integration
• Field Service Return and Repair

Zentech’s 50,000 sq.ft. (Baltimore), 92,000 sq. ft (Bloomington) and 25,000 sq. ft. (Dallas) facilities are registered to ISO 9001:2015 and AS9100D and use equipment and controls to utilize the latest assembly and test technology. Our equipment, systems and processes are optimized for flexibility in building complex products that have medium-volume/high mix requirements. Zentech supports specialized testing requirements and is equipped with multiple ESS environments.

New Product Introduction

Whether you are introducing a new product and require extensive design and development or if your needs are introducing a new or existing design into manufacturing, Zentech has the experience and resources to ensure a smooth transition.
Our team is experienced in all facets of both design and manufacturing engineering and we provide:

• Design Review
• Design for Manufacturability
• Compliance Testing and Support
• Prototype Support
• BOM and Configuration Control Support
• Alternate Sourcing for Price and Lead Time Reduction (with customer approval)
• Stencil Design
• Process Development and Improvement
• Test Fixture and Procedure Development
• Documentation

PCB Assembly

Zentech utilizes the latest in production technology to assemble your product efficiently and effectively. Our specialty is low to medium volume, high complexity and/or high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 and Class 3.