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  • ISO-13485-2016
  • ISO-9001-2015
  • DD2345
  • AS9100-2016
  • ITAR Certified
  • IPC Validation Services Recognized

Build – High Complexity, High Reliability

Zentech provides a wide range of manufacturing solutions specializing in high-complexity and high-reliability program requirements. Our services include:

  • Design for Manufacturability
  • Prototype and Volume Production
  • New Product Introduction
  • Printed Circuit Card Assembly
  • Lot Control and Traceability
  • Chassis and Box Build
  • Test Services
  • System Integration
  • Field Service Return and Repair

Zentech’s 50,000 sq.ft. (Baltimore), 92,000 sq. ft (Bloomington) and 25,000 sq. ft. (Dallas) facilities are registered to ISO 9001:2015 and AS9100D and use equipment and controls to utilize the latest assembly and test technology. Our equipment, systems and processes are optimized for flexibility in building complex products that have medium-volume/high mix requirements. Zentech supports specialized testing requirements and is equipped with multiple ESS environments.

New Product Introduction

Whether you are introducing a new product and require extensive design and development or if your needs are introducing a new or existing design into manufacturing, Zentech has the experience and resources to ensure a smooth transition.
Our team is experienced in all facets of both design and manufacturing engineering and we provide:

  • Design Review
  • Design for Manufacturability
  • Compliance Testing and Support
  • Prototype Support
  • BOM and Configuration Control Support
  • Alternate Sourcing for Price and Lead Time Reduction (with customer approval)
  • Stencil Design
  • Process Development and Improvement
  • Test Fixture and Procedure Development
  • Documentation

PCB Assembly

Zentech utilizes the latest in production technology to assemble your product efficiently and effectively. Our specialty is low to medium volume, high complexity and/or high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 and Class 3.

PCB Assembly Capabilities:

  • Rosin, No Clean and Aqueous Flux Chemistries
  • RoHs and Lead Only
  • High Speed Juki and Hanwha lines
  • 0201 SMT placement with Micro BGA to 2.5 mil ball diameter
  • Automated SMT print inspection
  • 13 Zone Reflow Ovens with 3 cool down zones (Great for heavier RF substrates)
  • BGA X-Ray
  • 3500W and 5000W Air Vac Rework Stations
  • Multiple Through-hole Assembly Areas
  • Automated Optical Inspection
  • 3D AXI
  • Conformal Coat
  • Bonding and Underfill
  • Potting
  • ICT and Functional Test
  • Box Build
Systems Assembly

Zentech understands well the demands of systems assembly and can create a customized solution to manage your supply chain requirements including:

  • Configure to Order/Build to Order
  • System Assembly at the Chassis, Cage or Rack Level
  • Custom Cabling
  • Board level and System Level Testing
  • Documentation Management (Lot Control, Serialization)

Unit Level Builds

Zentech provides full-turnkey manufacturing solutions to our customers and their programs to include electro-mechanical assembly processes. These processes include total unit level/box build operations to facilitate final integration of electronics into chassis and enclosures.

  • Small to Large (plastic/metal cases for sensitive electronic circuits to large heavy enclosures for military PDS)
  • Enclosures for portable and rack mounted electronics with RF shielding and welded supports
  • Software includes: AutoCAD, Inventor and Solid Works

Fulfillment Services

Zentech provides flexible and customized solutions for all phases of your product life cycle including direct customer ship and repair and return depot. Our skilled technicians can quickly troubleshoot problems to the component level eliminating the need for expensive warranty replacements. In addition, we will support product manufactured by others to provide a comprehensive integrated solution.

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