CIRCUIT CARD
ASSEMBLY
Zentech utilizes the latest in production technology to assemble your product efficiently and effectively. Our specialty is low to medium volume, high complexity and/or high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
SPECIFIC CAPABILITIES
SMT
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11 SMT Lines including Juki and Hanwha & Mycronic
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0201 SMT placement with Micro BGA to 2.5 mil ball diameter
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Leaded or non-leaded (ROHS)
Reflow Ovens
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13 Zone Reflow Ovens with 3 cool down zones (Great for heavier RF substrates)
Through Hole Assembly
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Zentech can support this older technology utilizing either manual insertion or semi-automated insertion equipment.
Cleaning
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Rosin, No Clean and Aqueous Flux Chemistries
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In-Line cleaning operations
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Effective for Bottom Terminated Components (BTC) and Low Profile Devices
Conformal Coat
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Acrylics, Polyurethanes, Silicone
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Manual & Automated
Certified Operators
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Zentech Operators are certified to IPC 610 and J-STD-001
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Select Zentech employees are also Certified IPC Trainers
New Product Introduction
The purpose of the NPI is to review customer requirements to create and incorporate the necessary manufacturing documents for sustained and effective product realization.
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NPI kick off meeting - discuss the customer requirements with Manufacturing Engineering, Quality, Configuration Control, and Purchasing teams.
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Technical Data Package review - manufacturing engineer reviews TDP and begins writing detailed assembly instructions and routers.
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NPI Lot Build - an initial build of a small quantity (5-10)
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Assembly Instructions and routers are finalized after NPI Lot Build