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IMG_1653.HEIC

CIRCUIT CARD
ASSEMBLY

Zentech utilizes the latest in production technology to assemble your product efficiently and effectively. Our specialty is low to medium volume, high complexity and/or high reliability assemblies compliant with a wide range of standards including IPC 610 Class 2 and Class 3.

SPECIFIC CAPABILITIES

SMT

  • 11 SMT Lines including  Juki and Hanwha & Mycronic

  • 0201 SMT placement with Micro BGA to 2.5 mil ball diameter

  • Leaded or non-leaded (ROHS)

Reflow Ovens

  • 13 Zone Reflow Ovens with 3 cool down zones (Great for heavier RF substrates)

Through Hole Assembly

  • Zentech can support this older technology utilizing either manual insertion or semi-automated insertion equipment.
     

Cleaning

  • Rosin, No Clean and Aqueous Flux Chemistries

  • In-Line cleaning operations

  • Effective for Bottom Terminated Components (BTC) and Low Profile Devices

Conformal Coat

  • Acrylics, Polyurethanes, Silicone

  • Manual & Automated
     

Certified Operators

  • Zentech Operators are certified to IPC 610 and J-STD-001

  • Select Zentech employees are also Certified IPC Trainers

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New Product Introduction

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The purpose of the NPI is to review customer requirements to create and incorporate the necessary manufacturing documents for sustained and effective product realization.

  • NPI kick off meeting - discuss the customer requirements with Manufacturing Engineering, Quality, Configuration Control, and Purchasing teams.

  • Technical Data Package review - manufacturing engineer reviews TDP and begins writing detailed assembly instructions and routers.

  • NPI Lot Build - an initial build of a small quantity (5-10)

  • Assembly Instructions and routers are finalized after NPI Lot Build

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